EB2532YA12-24.576M TR 数据手册
EB2532 Series
REGULATORY COMPLIANCE
2011/65 +
2015/863
191 SVHC
ITEM DESCRIPTION
Automotive Grade Quartz Crystal Resonator 2.5mm x 3.2mm x 0.8mm 4 Pad Ceramic Surface Mount (SMD)
ELECTRICAL SPECIFICATIONS
Nominal Frequency
8MHz to 66MHz
Frequency Tolerance/Stability
Aging at 25°C
±50ppm at 25°C, ±100ppm over -40°C to +85°C
±30ppm at 25°C, ±50ppm over -40°C to +85°C
±15ppm at 25°C, ±30ppm over -40°C to +85°C
±15ppm at 25°C, ±20ppm over -40°C to +85°C
±10ppm at 25°C, ±20ppm over -40°C to +85°C
±50ppm at 25°C, ±100ppm over -40°C to +105°C
±30ppm at 25°C, ±50ppm over -40°C to +105°C
±50ppm at 25°C, ±100ppm over -40°C to +125°C
±30ppm at 25°C, ±50ppm over -40°C to +125°C
±3ppm/year Maximum
Load Capacitance
Series Resonant, 7pF Parallel Resonant to 32pF Parallel Resonant
Shunt Capacitance
3pF Maximum
Equivalent Series Resistance
Mode of Operation
800 Ohms Maximum over Nominal Frequency of 8MHz to 9.999999MHz
250 Ohms Maximum over Nominal Frequency of 10MHz to 10.999999MHz
150 Ohms Maximum over Nominal Frequency of 11MHz to 11.999999MHz
100 Ohms Maximum over Nominal Frequency of 12MHz to 12.999999MHz
80 Ohms Maximum over Nominal Frequency of 13MHz to 15.999999MHz
70 Ohms Maximum over Nominal Frequency of 16MHz to 20.999999MHz
60 Ohms Maximum over Nominal Frequency of 21MHz to 29.999999MHz
50 Ohms Maximum over Nominal Frequency of 30MHz to 66MHz
AT-Cut Fundamental
Drive Level
200µWatts Maximum
Crystal Cut
AT-Cut
Spurious Response
Measured from Fo to Fo +5000ppm
-3dB Minimum
-50°C to +150°C
Storage Temperature Range
Insulation Resistance
Measured at 100Vdc
500 Megaohms Minimum
Revised B: 12/03/2021
Page 1 of 6
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EB2532 Series
PART NUMBERING GUIDE
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
MIL-STD-883, Method 3015, Class 1, HBM: 1500V
Fine Leak Test
MIL-STD-883, Method 1014, Condition A
Flammability
UL94-V0
Gross Leak Test
MIL-STD-883, Method 1014, Condition C
Mechanical Shock
MIL-STD-883, Method 2002, Condition B
Moisture Resistance
MIL-STD-883, Method 1004
Moisture Sensitivity
J-STD-020, MSL 1
Resistance to Soldering Heat
MIL-STD-202, Method 210, Condition K
Resistance to Solvents
MIL-STD-202, Method 215
Solderability
MIL-STD-883, Method 2003
Temperature Cycling
MIL-STD-883, Method 1010, Condition B
Vibration
MIL-STD-883, Method 2007, Condition A
Revised B: 12/03/2021
Page 2 of 6
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EB2532 Series
MECHANICAL DIMENSIONS
SUGGESTED SOLDER PAD LAYOUT
PIN
1
CONNECTION
Crystal
2
Cover/Ground
3
Crystal
4
Cover/Ground
All Tolerances are ±0.1
All Dimensions in Millimeters
Revised B: 12/03/2021
Page 3 of 6
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EB2532 Series
TAPE & REEL DIMENSIONS
Quantity per Reel: 3,000 Units
All Dimensions in Millimeters
Compliant to EIA-481
Revised B: 12/03/2021
Page 4 of 6
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EB2532 Series
RECOMMENDED SOLDER REFLOW METHOD
HIGH TEMPERATURE INFRARED/CONVECTION
TS MAX to TL (Ramp-up Rate)
3°C/Second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum(TS MAX)
- Time (ts MIN)
Ramp-up Rate (TL to TP)
150°C
175°C
200°C
60 - 180 Seconds
Time Maintained Above:
- Temperature (TL)
- Time (tL)
Peak Temperature (TP)
217°C
60 - 150 Seconds
Target Peak Temperature(TP Target)
250°C +0/-5°C
Time within 5°C of actual peak (tp)
20 - 40 Seconds
Ramp-down Rate
6°C/Second Maximum
Time 25°C to Peak Temperature (t)
8 Minutes Maximum
Moisture Sensitivity Level
Level 1
Additional Notes
Temperatures shown are applied to body of device.
3°C/Second Maximum
260°C Maximum for 10 Seconds Maximum
High Temperature Manual Soldering
260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)
Revised B: 12/03/2021
Page 5 of 6
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EB2532 Series
RECOMMENDED SOLDER REFLOW METHOD
LOW TEMPERATURE INFRARED/CONVECTION
TS MAX to TL (Ramp-up Rate)
5°C/Second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum(TS MAX)
- Time (tS MIN)
Ramp-up Rate (TL to TP)
N/A
150°C
N/A
30 - 60 Seconds
Time Maintained Above:
- Temperature (TL)
- Time (tL)
Peak Temperature (TP)
150°C
200 Seconds Maximum
Target Peak Temperature(TP Target)
245°C Maximum 2 Times/230˚C Maximum 1Time
Time within 5°C of actual peak (tP)
10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time
Ramp-down Rate
5°C/Second Maximum
Time 25°C to Peak Temperature (t)
N/A
Moisture Sensitivity Level
Level 1
Additional Notes
Temperatures shown are applied to body of device.
5°C/Second Maximum
245°C Maximum
Low Temperature Manual Soldering
185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)
Revised B: 12/03/2021
Page 6 of 6
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EB2532YA12-24.576M TR 价格&库存
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